Umgangatho ophezulu H3C UniServer R4900 G5

Umgangatho ophezulu we-H3C UniServer R4900 G5 Umfanekiso oPhambili

Inkcazelo emfutshane:

Amanqaku aphambili:Ukusebenza okuphezulu ukuthembeka okuphezulu, ukukala okuphezulu
Isizukulwana esitsha se-H3C UniServer R4900 G5 sibonelela ngomthamo obalaseleyo onokunyuka oxhasa ukuya kuthi ga kwi-28 NVMe drives ukomeleza ukuguquguquka koqwalaselo kumaziko edatha ale mihla.
I-H3C UniServer R4900 iseva ye-G5 yiseva ye-rack ye-H3C eziphuhliswe ngokwayo.
I-R4900 G5 isebenzisa i-3rd Gen Intel® Xeon® Scalable processors yamva nje kunye nememori yesi-8 ye-DDR4 enesantya se-3200MT/s ukuphakamisa ngamandla i-bandwidth ukuya kuma-60% xa kuthelekiswa neqonga langaphambili.
Nge 14 x PCIe3.0 I/O kwiindawo zokubeka kunye 2 xOCP 3.0 ukufikelela obalaseleyo IO scalability.
Ubuninzi be-96% yokusebenza kwamandla kunye ne-5 ~ 45 ℃ yokushisa yokusebenza inika abasebenzisi i-TCO ibuyisela kwiziko ledatha eluhlaza.

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I-R4900 G5 ilungiselelwe iimeko:

-Ukwenziwa kwezinto ezibonakalayo - Ixhasa iintlobo ezininzi zemisebenzi engundoqo kwiseva enye ukwenza lula utyalo-mali lwe-Infra.
-Idatha Enkulu - Lawula ukukhula okubonakalayo kolwazi olulungelelanisiweyo, olungacwangciswanga, kunye nolwakhiwe kancinci.
- Ukugcinwa kwesicelo esinzulu - gxotha umqobo wokusebenza
- Ugcino lwedatha/uhlahlelo — Idatha yombuzo kwimfuno ukunceda isigqibo senkonzo
-Ulawulo lobudlelwane boMthengi (CRM) -Nceda ukuba ufumane ulwazi olubanzi kwidatha yeshishini ukuphucula ukwaneliseka kwabathengi kunye nokunyaniseka
- Ucwangciso lwezibonelelo zeShishini (ERP) — Thembela nge-R4900 G5 ukuze ikuncede ulawule iinkonzo ngexesha lokwenyani
- (I-Virtual Desktop Infrastructure)VDI -Faka iinkonzo zedesktop ezikude ukunika abasebenzi bakho ukuguquguquka okusebenzayo nanini na, naphi na
-Ukusebenza okuphezulu kwekhompyuter kunye nokufunda okunzulu - Ukubonelela ngee-GPU ezaneleyo zokuxhasa ukufundwa koomatshini kunye nezicelo ze-AI
-Imizobo yeZiko leDatha yeZindlu yemidlalo yamafu exinana kakhulu kunye nokusasazwa kweendaba
- I-R4900 G5 ixhasa i-Microsoft® Windows® kunye neenkqubo zokusebenza ze-Linux, kunye ne-VMware kunye ne-H3C CAS kwaye inokusebenza ngokugqibeleleyo kwiimeko ze-IT ezingafaniyo.

Iinkcukacha zobugcisa

ICPU	I-2 x 3rd isizukulwana se-Intel® Xeon® Ice Lake SP series (iprosesa nganye ukuya kuthi ga kwi-40 cores kunye nobuninzi bokusetyenziswa kwamandla angama-270W)
I-chipset	I-Intel® C621A
Inkumbulo	32 x DDR4 DIMM kwiindawo zokubeka, ubuninzi be-12.0 TBU ukuya kwi-3200 MT/s izinga lokudlulisa idatha, inkxaso ye-RDIMM okanye i-LRDIMM Ukuya kuthi ga kwi-Intel ® Optane™ DC eZingisayo kwiModyuli yeMemori ye-PMem 200 uthotho (iBarlow Pass)
Isilawuli sokuGcina	Isilawuli se-RAID esizinzisiweyo (i-SATA RAID 0, 1, 5, kunye ne-10)I-PCIe esemgangathweni ye-HBA yesilawuli okanye isilawuli sokugcina, ngokuxhomekeke kwimodeli
FBWC	I-8 GB DDR4 cache, ngokuxhomekeke kwimodeli, inkxaso yokukhusela i-supercapacitor
Ugcino	Ukuya kuthi ga ngaphambili iibheyi ze-12LFF, iibheyi ze-4LFF zangaphakathi, ngasemva 4LFF+4SFF iibheyiUkuya ngaphambili kwiibheyi ze-25SFF, iibheyi zangaphakathi ze-8SFF, ngasemva 4LFF+4SFF bays Ngaphambili/Ngaphakathi SAS/SATA HDD/SSD/NVMe Drives, ubuninzi 28 x U.2 NVMe Drives SATA okanye PCIe M.2 SSDs, 2 x SD ikhadi kit , kuxhomekeke imodeli
Uthungelwano	I-1 x kwibhodi ye-1 Gbps yolawulo lwenethiwekhi port2 x OCP 3.0 kwiindawo zokubeka i-4 x 1GE okanye i-2 x 10GE okanye i-2 x 25GE NICs Iindawo zokubeka ezisemgangathweni zePCIe 1/10/25/40/100/200GE/IB Ethernet iadaptha
PCIe kwiindawo zokubeka	14 x PCIe 4.0 kwiindawo zokubeka eziqhelekileyo
Amazibuko	Izibuko ze-VGA (Ngaphambili nangasemva) kunye nezibuko ze-serial (RJ-45) 6 x USB 3.0 izibuko (2 ngaphambili, 2 ngasemva, 2 yangaphakathi) Ulawulo olu-1 oluzinikeleyo lwezibuko lohlobo C
GPU	14 x single-slot ububanzi okanye 4 x kabini-slot ububanzi iimodyuli GPU
I-Optical drive	Optical disk drive yangaphandle , ozikhethelayo
Ulawulo	Inkqubo ye-HDM OOB (enezibuko lolawulo oluzinikeleyo) kunye ne-H3C iFIST/FIST, imodeli ephathwayo yeLCD
Ukhuseleko	Ubukrelekrele boKhuseleko lwangaphambili lweBezel *Ukufunyanwa kweChassis yokuNgena TPM2.0 Ingcambu yeSilicon yeTrasti Ukuloga ngogunyaziso lwezinto ezimbini
Ukunikezwa Amandla	2 x iPlatinam 550W/800W/850W/1300W/1600W/2000/2400W (1+1 ukungafuneki) , ngokuxhomekeke kumzekelo 800W –48V DC umbane (1+1 Ukungafuneki)Iifeni ezitshintshayo ezishushu ezingafunekiyo
Imigangatho	CE,UL, FCC, VCC, EAC, njl.
Ubushushu bokusebenza	5°C ukuya ku-45°C (41°F ukuya ku-113°F)Ubushushu obuphezulu bokusebenza buguquguquka ngokucwangciswa kweseva.Ngolwazi oluthe vetshe, jonga amaxwebhu obugcisa esixhobo.
Imilinganiselo (H×W × D)	2U UbudeNgaphandle kwebezel yokhuseleko: 87.5 x 445.4 x 748 mm (3.44 x 17.54 x 29.45 ngaphakathi) Ngebezel yokhuseleko: 87.5 x 445.4 x 776 mm (3.44 x 17.54 x 30.55 ngaphakathi)