Ungasebenzisa i-R4900 G3 ukuxhasa ezi nkonzo zilandelayo
-Ukwenziwa kwezinto ezibonakalayo - Ixhasa iindidi ezininzi zemisebenzi kwiseva enye ukugcina indawo
-Idatha Enkulu -Lawula ukukhula okubonakalayo kolwazi olulungelelanisiweyo, olungacwangciswanga, kunye nolwakhiwe kancinci.
- Izicelo ezigxile ekugcinweni - Susa i-I / O ibhotile kwaye uphucule ukusebenza
- Ugcino lwedatha/uhlahlelo — Idatha yombuzo kwimfuno ukunceda isigqibo senkonzo
-Ulawulo lobudlelwane boMthengi (CRM) -Nceda ukuba ufumane ulwazi olubanzi kwidatha yeshishini ukuphucula
ukwaneliseka kwabathengi kunye nokunyaniseka
- Ucwangciso lwezibonelelo zeShishini (ERP) — Thembela nge-R4900 G3 ukuze ikuncede ulawule iinkonzo ngexesha lokwenyani
-Isiseko se-desktop esibonakalayo (VDI) -Isebenzisa inkonzo yedesktop ekude ukuzisa i-ofisi enkulu kwaye isebenze
ukunxibelelana ngomnxeba nangasiphi na isixhobo naphi na nanini na
-Ukusebenza okuphezulu kwekhompyuter kunye nokufunda okunzulu-Nikeza iimodyuli ze-GPU ezi-3 ezineslot ezibanzi kwindawo yeenyawo ze-2U, ukuhlangabezana
iimfuno zokufunda koomatshini kunye nezicelo ze-AI
Iinkcukacha zobugcisa
| Ukusebenzisa ikhompyutha | I-2 × 2nd Generation Intel Xeon Scalable Processors (CLX & CLX-R) (Ukuya kuthi ga kwi-28 cores kunye nokusetyenziswa kwamandla aphezulu angama-205 W) |
| Inkumbulo | 3.0 TB (ubuninzi)24 × DDR4 DIMMs (Ukuya kuthi ga kwi-2933 MT / s izinga lokudlulisa idatha kunye nenkxaso ye-RDIMM kunye ne-LRDIMM) (Ukuya kwi-12 ye-Intel ® Optane™ DC yeModyuli yeMemori eZingisayo.(DCPMM) |
| Isilawuli sokuGcina | Umlawuli we-RAID ofakelweyo (i-SATA RAID 0, 1, 5, kunye ne-10)Amakhadi e-PCIe aqhelekileyo e-HBA kunye nezilawuli zokugcina (Ngokuzikhethela) |
| FBWC | 8 GB DDR4-2133MHz |
| Ugcino | Ngaphambili 12LFF + ngasemva 4LFF kunye 4SFF okanye ngaphambili 25SFF + ngasemva 2SFF ixhasa SAS/SATA HDD/SSD, ixhasa ukuya kuthi ga kwiidrive zeNVMe ezingama-24 480 GB SATA M.2 SSDs (Ngokuzikhethela) amakhadi SD |
| Uthungelwano | I-1 × kwibhodi ye-1 Gbps yolawulo lwenethiwekhi port1 × mL OM Ethernet i-adapter ebonelela nge-4 × 1GE izibuko zobhedu okanye i-2 × 10GE izibuko zobhedu / zefayibha I-1 × iiadaptha ze-Ethernet zePCIe (Ngokuzikhethela) |
| PCIe kwiindawo zokubeka | I-10 × PCIe 3.0 slots (i-slots ezisibhozo eziqhelekileyo, enye ye-Mezzanine yokugcina isilawuli, kunye ne-adapter ye-Ethernet) |
| Amazibuko | Isidibanisi seVGA yangaphambili (Ngokhetho)Isiqhagamshelo seVGA yangasemva kunye nesiqhagamshelanisi sothotho 5 × USB 3.0 izihlanganisi (enye ngaphambili, ezimbini ngasemva, kunye ezimbini kumncedisi) 1 × USB 2.0 isiqhagamshelo (Ngokuzikhethela) 2 × iindawo zokubeka zeMicroSD (Ngokuzikhethela) |
| GPU | I-3 × iimodyuli ze-GPU ezine-slot ebanzi okanye i-4 × iimodyuli ze-GPU ezine-slot enye |
| I-Optical drive | I-Optical drive yangaphandleKukuphela kweemodeli ze-8SFF zokuqhuba ezixhasa iidrive ezakhelwe ngaphakathi |
| Ulawulo | I-HDM (enezibuko lolawulo oluzinikeleyo) kunye ne-H3C FIST |
| Ukhuseleko | Inkxaso yokuFumana kokuNgena kweChassis, TPM2.0 |
| Unikezelo lwamandla kunye nokuphefumla | IPlatinam 550W/800W/850W/1300W/1600W, okanye 800W –48V DC izixhobo zombane (1+1 redundancy) Iifeni ezitshintshayo ezishushu (zixhasa ukungafuneki) |
| Imigangatho | CE, UL, FCC, VCC, EAC, njl. |
| Ubushushu bokusebenza | 5°C ukuya ku-50°C (41°F ukuya ku-122°F)Ubushushu obuphezulu bokusebenza buguquguquka ngokucwangciswa kweseva. |
| Imilinganiselo (H × W × D) | Ngaphandle kwebezel yokhuseleko: 87.5 × 445.4 × 748 mm (3.44 × 17.54 × 29.45 ngaphakathi)Ngebezel yokhuseleko: 87.5 × 445.4 × 769 mm (3.44 × 17.54 × 8 in) 30. |
Umboniso weMveliso
